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1

The use of MASW method in the assessment of soil liquefaction potential

Chih-Ping Lin, Cheng-Chou Chang, Tzong-Sheng Chang

Journal:

Soil Dynamics and Earthquake Engineering

Year:

2004

Language:

english

File:

PDF, 411 KB

english, 2004

2

Diffusion barrier study on TaSix and TaSixNy

Wen-Chun Wang, Tzong-Sheng Chang, Fon-Shan Huang, Jiann-Ruey Chen

Journal:

Thin Solid Films

Year:

1993

Language:

english

File:

PDF, 778 KB

english, 1993

3

A New High-Density Twin-Gate Isolation One-Time Programmable Memory Cell in Pure 28-nm CMOS Logic Process

Hsiao, Woan Yun, Peng, Ping Chun, Chang, Tzong-Sheng, Chih, Yu-Der, Tsai, Wu-Chin, Chang, Meng-Fan, Chien, Tun-Fei, King, Ya-Chin, Lin, Chrong-Jung

Journal:

IEEE Transactions on Electron Devices

Year:

2015

Language:

english

File:

PDF, 2.81 MB

english, 2015

4

High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology

Peng, Ping Chun, Chen, Yu-Zheng, Hsiao, Woan Yun, Chen, Kuang-Hsin, Lin, Ching-Pin, Tien, Bor-Zen, Chang, Tzong-Sheng, Lin, Chrong Jung, King, Ya-Chin

Journal:

IEEE Electron Device Letters

Year:

2015

Language:

english

File:

PDF, 618 KB

english, 2015

5

Rapid thermal nitridation of titanium on Cu/Si contact system

Tzong-Sheng Chang, Wen-Chun Wang, Fon-Shan Huang, Lih-Ping Wang, Jenn-Chang Hwang

Journal:

Solid-State Electronics

Year:

1995

Language:

english

File:

PDF, 519 KB

english, 1995

6

Study of tantalum-based diffusion barriers between Al and Si

Wen-Chun Wang, Tzong-Sheng Chang, Fon-Shan Huang

Journal:

Solid-State Electronics

Year:

1994

Language:

english

File:

PDF, 438 KB

english, 1994

7

Multi-station analysis of surface wave dispersion

Chih-Ping Lin, Tzong-Sheng Chang

Journal:

Soil Dynamics and Earthquake Engineering

Year:

2004

Language:

english

File:

PDF, 514 KB

english, 2004

8

Characterization of Multilayer Metal Gate Fuse in 28-nm CMOS Logic Technology

Hsieh, Min-Che, Lin, Yu-Cheng, Chin, Yung-Wen, Chang, Tzong-Sheng, King, Ya-Chin, Lin, Chrong-Jung

Journal:

IEEE Electron Device Letters

Year:

2013

Language:

english

File:

PDF, 825 KB

english, 2013

9

[IEEE 2013 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2013.12.9-2013.12.11)] 2013 IEEE International Electron Devices Meeting - Ultra high density 3D via RRAM in pure 28nm CMOS process

Hsieh, Min-Che, Liao, Yu-Cheng, Chin, Yung-Wen, Lien, Chen-Hsin, Chang, Tzong-Sheng, Chih, Yue-Der, Natarajan, Sreedhar, Tsai, Ming-Jinn, King, Ya-Chin, Lin, Chrong Jung

Year:

2013

Language:

english

File:

PDF, 3.40 MB

english, 2013

10

[IEEE 1995 International Symposium on VLSI Technology, Systems, and Applications. - Taipei, Taiwan (31 May-2 June 1995)] 1995 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers - The study of diffusion barrier layer TiN in Cu/TiN/TiSi/sub 2//Si contact system

Tzong-Sheng Chang,, Wen-Chun Wang,, Fon-Shan Huang,

Year:

1995

Language:

english

File:

PDF, 314 KB

english, 1995

11

Thermal stability study of TiN/TiSi2 diffusion barrier between Cu and n+Si

Chang, Tzong-Sheng, Wang, Wen-Chun, Wang, Lih-Ping, Hwang, Jenn-Chang, Huang, Fon-Shan

Journal:

Journal of Applied Physics

Year:

1994

Language:

english

File:

PDF, 931 KB

english, 1994

12

[IEEE 2014 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2014.12.15-2014.12.17)] 2014 IEEE International Electron Devices Meeting - Point twin-bit RRAM in 3D interweaved cross-point array by Cu BEOL process

Yung-Wen Chin,, Shu-En Chen,, Hsieh, Min-Che, Tzong-Sheng Chang,, Chrong Jung Lin,, Ya-Chin King,

Year:

2014

Language:

english

File:

PDF, 1.79 MB

english, 2014

13

Self-Rectifying Twin-Bit RRAM in 3-D Interweaved Cross-Point Array

Chen, Shu-En, Chin, Yung-Wen, Hsieh, Min-Che, Liao, Chu-Feng, Chang, Tzong-Sheng, Lin, Chrong-Jung, King, Ya-Chin

Journal:

IEEE Journal of the Electron Devices Society

Year:

2015

Language:

english

File:

PDF, 674 KB

english, 2015

14

Via Diode in Cu Backend Process for 3D Cross-Point RRAM Arrays

Liao, Yu-Cheng, Pan, Hsin-Wei, Hsieh, Min-Che, Chang, Tzong-Sheng, Chih, Yu-Der, Tsai, Ming-Jinn, Lin, Chrong Jung, King, Ya-Chin

Journal:

IEEE Journal of the Electron Devices Society

Year:

2014

Language:

english

File:

PDF, 915 KB

english, 2014

15

On-Chip Recovery Operation for Self-Aligned Nitride Logic Non-Volatile Memory Cells in High-K Metal Gate CMOS Technology

Lin, Po-Yen, Chiu, Yu-Lun, Sung, Yuh-Te, Chen, Jim, Chang, Tzong-Sheng, King, Ya-Chin, Lin, Chrong Jung

Journal:

IEEE Journal of the Electron Devices Society

Year:

2015

File:

PDF, 1.02 MB

2015

16

[IEEE 2014 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2014.12.15-2014.12.17)] 2014 IEEE International Electron Devices Meeting - A new saw-like self-recovery of interface states in nitride-based memory cell

Yuh-Te Sung,, Po-Yen Lin,, Jim Chen,, Tzong-Sheng Chang,, King, Ya-Chin, Lin, Chrong Jung

Year:

2014

Language:

english

File:

PDF, 1.71 MB

english, 2014

17

On-Chip Recovery Operation for Self-Aligned Nitride Logic Non-Volatile Memory Cells in High-K Metal Gate CMOS Technology

Lin, Po-Yen, Chiu, Yu-Lun, Sung, Yuh-Te, Chen, Jim, Chang, Tzong-Sheng, King, Ya-Chin, Lin, Chrong Jung

Journal:

IEEE Journal of the Electron Devices Society

Year:

2015

Language:

english

File:

PDF, 1.02 MB

english, 2015

18

Thermal Stability Study on Cu/Tin/TiSi2/Si

Chang, Tzong-Sheng, Wang, Wen-Chun, Wang, Lih-Ping, Hwang, Jenn-Chang, Huang, Fon-Shan

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 1.10 MB

english, 1993

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